Featured in EE Times!

June 2, 2016

“We see ourselves as a key technology provider for the next wave of semiconductor advanced packaging. Our business model is licensing.”says Anders Johansson CEO of Smoltek to EE Times.

Smoltek was featured in EE Times on the 25th of May with an article about Ultra-Dense 3-D Packaging for IoT and how Smoltek will beat Moore´s law.

We are really pleased about the article!

Read it here.

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