Meet with us at the IPC Conference on Component Technology September 10-12

August 1st, 2013

Smoltek will participate in the upcoming IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, September 10-12, 2013 at the Hilton, Chandler, AZ, USA.

Smoltek’s IP and technology truly supports the future needs of the Semicon Advanced Packaging industry by enabling significantly decreased Micro-bump pitch and size. The same basic technology also offers excellent characteristics when utlized as a Thermal Interface Material to improve heat dissipation from chip to package.

Meet up with us to learn more! IPC event website: IPC Conference on Component Technology


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