Based on the initial core patent: Controlled growth of a nanostructure on a substrate, we have developed a complete technology platform that now will be expanded to cover multiple application areas starting with semiconductor advanced packaging.

Dr. M Shafiq Kabir, CIO

Shafiq completed his PhD in Microtechnology and Nanoscience at Chalmers University of Technology. Shafiq has authored or co-authored +30 highly cited scientific papers and his research and patent work forms the basis for the Smoltek IP.

“Based on the initial core patent: Controlled growth of a nanostructure on a substrate, we have developed a complete technology platform that now will be expanded to cover multiple application areas starting with semiconductor advanced packaging.”

Dr. M Shafiq Kabir, CIO

Shafiq completed his PhD in Microtechnology and Nanoscience at Chalmers University of Technology. Shafiq has authored or co-authored +30 highly cited scientific papers and his research and patent work forms the basis for the Smoltek IP.

Patents

Smoltek is a technology provider that pioneers carbon nanotechnology for the next generation of electronics miniaturization. Our strategic and continuous development of our patent portfolio is driven by the need for disruptive materials and technical solutions that enables industrially compatible fabrication of nanostructures for various applications.


Granted Patents

 

USA

  • US 7 977 761
  • US 7 687 876
  • US 7 777 291
  • US 8 183 659
  • US 8 415 787
  • US 8 106 517
  • US 8 253 253
  • US 8 508 049
  • US 8 815 332
  • US 8 866 307
  • US 9 028 242
  • US 9 114 993
  • US 9 206 532

Europe

  • 1 874 986
  • 2 587 514
  • 2 586 744
  • 2 630 281
  • 1 945 840

Russia

  • 2 406 689
  • 2 573 474

India

  • 264 325
  • 266 759

Philippines

  • 12011500242

Japan

  • JP594 39 47
  • JP534 99 56
  • JP540 55 74
  • JP547 48 35
  • JP551 99 36
  • JP553 59 15
  • JP612 67 25
  • JP614 90 77

South Korea

  • KR101 638 463
  • KR101 361 946
  • KR101 365 341
  • KR101 386 268
  • KR101 487 346
  • KR101 736 303
  • KR101 903 714

China

  • CN101189372B
  • CN101313092B
  • CN101827782B
  • CN103154340B
  • CN102119363B
  • CN102709132B
  • CN102007571B
  • CN105441903B
  • CN10460057B

Taiwan

  • I465389
  • I511208
  • I564980

Malaysia

  • MY-153444-A

Patents Structured by Applications

SmolINPO™
(Interposer)

An  interposer concept with its key features based on conductive nanostructures. SmoltekINPO facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions. Patents pending.


SmolGROW™
(Core Technology)
Enables to grow nanostructures on a substrate (metal/semiconductor/insulator) with flexibility to define and tailor the properties of the grown nanostructures. Suitable for generic growth processes of nanostructures.

Patent No.: EP2586744, US7687876, US7977761, US7777291, US8183659, US8415787, US8866307, US9114993, US9206532, US8508049, EP2630281, CN103154340B, RU2573474, CN101189372B, CN102709132B, EP1874986, IN234325, JP5349956, KR101361946, CN102007571B, JP5474835, JP5943947, KR101638463, TW1465389, RU2406689, KR101736303, JP6126725, CN105441903B


SmollNCO™
(Inter Connects)
Ultra fine pitch interconnects, that supports advanced component integration, providing higher performance at a significantly reduced footprint.

Patent No.: EP2586744, US7687876, US7977761, US8106517, US8253253, US8183659, US8415787, US8815332, US9206532, TWI511208, JP5349956, JP5535915, EP1945840, CN101313092B, IN266759, JP5519936, KR101365341, KR101386268, US7777291, EP2630281, KR101736303, JP6126725, JP6149077, CN105441903B


SmolCACH™
(Capacitor on Chip)
Integrated capacitors for decoupling, filtering and energy storage.

Patent No.:EP2586744, US7687876, US7977761, US7777291,  US8183659,  US8415787,  US8866307, US9114993, US9206532, US9114993, US8508049, US9206532, RU2573474, CN103154340B, CN101189372B, CN102709132B, EP1874986, EP2586744, IN264325, JP5349956, KR101361946, EP2630281, EP2630281, RU2406689, KR101736303, JP6126725, CN10544190B


SmolTIM™
(Thermal Interface Materials) 
Facilitates higher performance and sustained lifetime for RF and Power Electronics components.

Patent No.: EP2586744, US7687876, US7977761, US7777291, US8106517, US8253253,  US8815332, TWI511208, JP5535915, CN101827782B, KR101487346, TW1511208,  CN103154340B,  EP2630281,  RU2573474,  US9206532, CN101313092B, EP1945840, IN266759, JP5519936,  KR101365341, KR101386268, US8415787, TW1564980, KR101736303, JP6149077, CN105441903B


SmolNIL™
(Nano Imprint Litography)  

Enables to fabricate high aspect ratio (>1:10) imprint mold/mask with predefined shapes.

Patent No.: EP2586744, US7687876, US7777291, US8508049, US9206532, US9028242, JP5405574, CN102119363B, MY153444A, PH12011500242, CN102007571, CN103154340B, KR101638463, EP2630281

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