Supplier Updates from ECTC 2016


July 1, 2016

Our CTO, Vincent Desmaris, meet up with Francoise von Trapp from 3DInCites during ECTC 2016 in Las Vegas.They talked about the latest accomplishments that will impact the future of advanced semiconductor packaging, including interposer integration and 3D integration technologies.

“Although Smoltek’s processes were developed 10 years ago, achieving the low-temp aspect allows for nanostructure growth on an active device, making it possible to grow fine-pitch bumps directly on bond pads, or create on-chip capacitors.” – Francoise in 3D.

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