We are proud to announce that Smoltek is selected to pitch at the Venture Summit West 2016 event in Mountain View California on March 2nd.
Posts Tagged ‘Events’
Dec 4, 2014
Smoltek CEO Anders Johansson attends the IP Business Congress Asia in Shanghai, China, December 7th – 9th, IPBCAsia.
Sep 15, 2014
Meet with us at SEMICON Europa 2014 in Grenoble France, October 7th – 9th. Smoltek will be part of the Innovation Village exhibition, booth #482.
Smoltek will participate in the upcoming IPC Conference on Component Technology: Closing the Gap in the Chip to PCB Process, September 10-12, 2013 at the Hilton, Chandler, AZ, USA.
Smoltek’s IP and technology truly supports the future needs of the Semicon Advanced Packaging industry by enabling significantly decreased Micro-bump pitch and size. The same basic technology also offers excellent characteristics when utlized as a Thermal Interface Material to improve heat dissipation from chip to package.Meet up with us to learn more! IPC event website: IPC Conference on Component Technology