Historically, nanomaterials have been invented, developed and extensively studied for their usefulness for different applications among the research community. Smoltek is continuously carrying out R&D together with industrial partners to further develop different processes to take the nanomaterials to mainstream industrial integration and making our own technology available on the market.
Smoltek protects its innovative nanotechnology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how with trade secrets and provides its technology to customers through IP licensing and/or strategic partnerships.The company has developed the SMOLTEK TigerTM smart assembly platform for proprietary nanostructure fabrication and direct integration without transfer. SMOLTEK TigerTM is based on CMOS compatible catalytic low temperature growth processing, resulting in controlled growth of exactly located and defined clusters or films of carbon nanostructures particularly optimized for integration in Advanced Semiconductor Packaging applications such as:
- SmolCACHTM – Integrated solid-state capacitors
- SmolTIMTM – Thermal Interface Material
- SmolINCOTM – 2.5D & 3D Interconnects
ApplicationsThe SmolCACH™ concept offers integration of tailored high-performance solid-state capacitors in Advanced Semiconductor Packaging applications such as for Decoupling, Filtering or Energy Storage. The SmolCACH™ capacitors can be integrated on passive silicon or glass interposers or even on active CMOS devices. Benefits include:
- Ultra-low profile and customized layout design provides unparalleled design freedom.
- Carbon Nanotech enabled 3D high surface area construction.
- Capacitors can be tailored for filtering, decoupling or energy storage supported by high capacitance / footprint area.
- Manufactured by proven CMOS microfabrication processes.
- End user application areas include: SiP, IoT and sensors as well as RF- and high speed digital components.
The SmolINCO™ improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.The SmolINCO™ concept utilizes Carbon Nanofibers (CNF) to improve microbump interconnect performance in Advanced Semiconductor Packaging:
- CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.
- The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.
- CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.
- Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.
MC2MC2 The Department of Microtechnology and Nanoscience is a unique research department at Chalmers University of Technology in the areas of micro- and nanotechnology, housing more than 200 researchers and PhD students.
Publications:Saleem, A. M. ; Kuzmenko, V. ; Desmaris, V. et al. (2016). Development of Supercapacitor based on carbon nanostructures as electrode materials, Micronano System Workshop MSW 2016, 17-18 May, Lund, Sweden.
Saleem, A. M. ; Desmaris, V. ; Enoksson, P. (2016). Performance Enhancement of Carbon Nanomaterials for Supercapacitors, Journal of Nanomaterials. 2016 p. 17.
Desmaris, V. ; Saleem, A. M. ; Shafiee, S. (2015). Examining Carbon Nanofibers: Properties, growth, and applications. IEEE Nanotechnology Magazine. 9 (2) s. 33-38.
Saleem, A. M. ; Göransson, G. ; Desmaris, V. et al. (2015). CMOS compatible on-chip decoupling capacitor based on vertically aligned carbon nanofibers. Solid-State Electronics. 107 s. 15-19.
Saleem, A. M. ; Shafiee, S. ; Krasia-Christoforou, T. et al. (2015). Low temperature and cost-effective growth of vertically aligned carbon nanofibers using spin-coated polymer-stabilized palladium nanocatalysts. Science and Technology of Advanced Materials. 16 (1) s.
Desmaris, V. ; Saleem, A. M. ; Shafiee, S. et al. (2014). Carbon Nanofibers (CNF) for Enhanced Solder-based Nano-Scale Interconnects and Packaging Solutions., Proceedings of Semicon Taiwan 2014.
Desmaris, V. ; Saleem, A. M. ; Shafiee, S. et al. (2014). Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions, Proceedings of the Electronic Components and Technology Conference (ECTC), Orlando, FL, USA. s. 1071 – 1076.
Desmaris, V. ; Shafiee, S. ; Kabir, M. et al. (2014). Is it time to Reinforce In-package Solder Joints Using CNF?. MEPTEC report. Spring 2014 s. 20-21.
Kuzmenko, V. ; Saleem, A. M. ; Naboka, O. et al. (2014). Carbon Nanotubes/Nanofibers Composites from Cellulose as Electrodes for Sustainable Energy Devices, The World Conference on Carbon (Carbon2014), June 29 – July 4, Jeju, South Korea. ORT6-54
Kuzmenko, V. ; Saleem, A. M. ; Naboka, O. et al. (2014). Carbon nanotubes/nanofibers composites from cellulose for supercapacitors, 16th European Conference on Composite Materials, ECCM 2014; Seville; Spain; 22 June 2014 through 26 June 2014.
Staaf, H. ; Saleem, A. M. ; Göransson, G. et al. (2013). Carbon nanotubes as electrode for supercapacitors, 2nd International Conference on Materials for Energy, May 12-16, 2013 and Karlsruhe, Germany.
Kabir, M. ; Desmaris, V. ; Saleem, A. M. et al. (2011). A Test Vehicle for RF/DC Evaluation and Destructive Testing Of Vertically Grown Nanostructures (VGCNS), Proceedings of the NT11 International Conference on the Science and Application of Nanotubes, Cambridge, UK, July 10-16, 2011.
Saleem, A. M. ; Berg, J. ; Desmaris, V. et al. (2009). Carbon nanostructures perform high aspect ratio nanoimprinting. nanotechweb.
Saleem, A. M. ; Berg, J. ; Desmaris, V. et al. (2009). Nanoimprint lithography using vertically aligned carbon nanostructures as stamp. Nanotechnology. 20 (37) s. 375302-375306.
Alavian Ghavanini, F. ; lepoche, H. ; Berg, J. et al. (2008). Compatibility Assessment of CVD growth of Carbon nanofibers on bulkCMOS devices. NANO LETTERS.
Complete publication list by Vincent Desmaris