Historically, nanomaterials have been invented, developed and extensively studied for their usefulness for different applications among the research community. Smoltek is continuously carrying out R&D together with industrial partners to further develop different processes to take the nanomaterials to mainstream industrial integration and making our own technology available on the market.
Smoltek protects its innovative nanotechnology with a portfolio of more than 60 patents granted and pending, as well as a significant body of know-how with trade secrets and provides its technology to customers through IP licensing and/or strategic partnerships.
The company has developed the SMOLTEK TigerTM smart assembly platform for proprietary nanostructure fabrication and direct integration without transfer. SMOLTEK TigerTM is based on CMOS compatible catalytic low temperature growth processing, resulting in controlled growth of exactly located and defined clusters or films of carbon nanostructures particularly optimized for integration in Advanced Semiconductor Packaging applications such as:
- SmolCACHTM – Integrated solid-state capacitors
- SmolTIMTM – Thermal Interface Material
- SmolINCOTM – 2.5D & 3D Interconnects
The SmolCACH™ concept offers integration of tailored high-performance solid-state capacitors in Advanced Semiconductor Packaging applications such as for Decoupling, Filtering or Energy Storage. The SmolCACH™ capacitors can be integrated on passive silicon or glass interposers or even on active CMOS devices.
- Ultra-low profile and customized layout design provides unparalleled design freedom.
- Carbon Nanotech enabled 3D high surface area construction.
- Capacitors can be tailored for filtering, decoupling or energy storage supported by high capacitance / footprint area.
- Manufactured by proven CMOS microfabrication processes.
- End user application areas include: SiP, IoT and sensors as well as RF- and high speed digital components.
The SmolINCO™ improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding. The SmolINCO™ concept utilizes Carbon Nanofibers (CNF) to improve microbump interconnect performance in Advanced Semiconductor Packaging:
- CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.
- The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.
- CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.
- Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.
MC2 The Department of Microtechnology and Nanoscience is a unique research department at Chalmers University of Technology in the areas of micro- and nanotechnology, housing more than 200 researchers and PhD students.
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