The enormous potential within the wide Smoltek IP-platform is the base for our pursuit in various technology sectors. By evaluate different challenges in each market we identify new opportunities for us to provide revolutionizing solutions for future applications.
Besides serving the semiconductor and hydrogen industries with new, disruptive application technologies we have already set up plans to scope new areas that can be beneficial of our technology solutions, such as the energy storage sector and the med-tech sector. This, however, are fields where we not yet have had enough time and recourses to fully explore.
Future solutions within medtech/biotech
Medical technology is an application sector where we see great benefits for our technology. As an example, we can take electrodes for electrostimulation / therapy (nerve connections) that can give the patient relief from pain with the help of new nanotechnology. Another example is to create an improved interface between organic tissue and carbon nanofilm on the surface of the “hardware”, such as implants, fixtures or prostheses.
Future solutions within energy storage
We continuously evaluate different applications in energy storage, and here battery technology is an interesting area where surface conditions are central to performance, as today’s materials limit efficiency, service life and safety. As an example we can look at (Li-ion) solid-state batteries which with our nanotechnology could offer higher energy density, extended charging capacity, better temperature performance and reduced flammability compared to today’s batteries.
Future solutions within semiconductors
We have previously developed a number of technology concepts for the semiconductor industry. These are at different stages of development, but all of them have had to stand back due to our current development of ultra-thin capacitors. As the company develops, there is an opportunity for us to resume some of them again.
SMOLTEK Tiger™ – smart assembly platform
Smoltek Tiger is an assembly platform concept for advanced packaging and heterogenous integration that consists of integrated capacitors, interconnects and interposers that are incapsulated by a thermal heat dissipation film.
SmolINCO – component integration interconnects (Application in SMOLTEK Tiger™)
The SmolINCO concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.
SmolINPO – Interposers concept (Application in SMOLTEK Tiger™)
SmolINPO is our interposer concept based on super conductive nanostructures. It facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions.
SmolTIM – Thermal enhancement materials (Application in SMOLTEK Tiger™)
SmolTIM is Smoltek’s heat dissipation concept that facilitates higher performance and sustained lifetime for RF and Power Electronics components.
SmolNIL – Nano imprint lithography
SmolNIL is our nanoscale imprint technology that enables us to fabricate high aspect ratio (>1:10) imprint mold/mask with predefined shapes.
SmolCAP – Supercapacitors concept
SmolCAP is an ultrathin high performance supercapacitor concept based on our carbon nanofiber technology.
Want to know more about our disruptive nanotechnology and how it can be implemented in different industry sectors? Contact us!