ECTC 2021 – June 1 - July 4, 2021
Watch Smoltek's presentations in the technical sessions (virtual)
For registration go to https://www.ectc.net/
Session 27 – Novel high-frequency integrated modules and system
Presentation no: 4
Title: High-Frequency Electrical Circuit Model for Integrated Capacitors Utilizing Lossy Nanostructures
Session 36 – Packaging, machine learning, and integration technologies
Presentation no: 2
Title: Reliability, Solderability and Electrical Performance of High Density Ultra Thin Capacitors Based on Carbon Nanofibers
Session 45 – Heterogeneous integration, flex and emerging technologies
Presentation no: 7
Title: Flip Chip Interconnects Based on Carbon Nanofibers-Solder Composites
INTRODUCING CARBON CAPACITORS:
SEM picture of the CNF-MIM capacitor die
SEM picture shows side-view of the CNF-MIM die
”Capacitors so thin they fit everywhere”
Earlier this spring Smoltek presented: ”the thinnest capacitors in the world”. It's a prototype of our capacitor technology based on carbon nanofibers and how they are developed for further miniaturization of semiconductor components.
Carbon capacitor properties: High capacitance density | Low ESR | Low ESL | Extremely small form factor | So thin they fit (almost) everywhere.
Applications: Discrete component (embedded, landside, hybrid bonding) or fully integrated.
Related presentation, session 36: Reliability, Solderability and Electrical Performance of High Density Ultra Thin Capacitors Based on Carbon Nanofibers
Smoltek VP Product Management, Karl Lundahl on the next phase for CNF-MIM.
Smoltek explained in 30 seconds.