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ECTC 2021 – June 1 - July 4, 2021

Watch Smoltek's presentations in the technical sessions (virtual)

For registration go to https://www.ectc.net/

Session 27 – Novel high-frequency integrated modules and system

Presentation no:

Title: High-Frequency Electrical Circuit Model for Integrated Capacitors Utilizing Lossy Nanostructures

Link: https://www.ectc.net/program/session27.cfm  

Session 36 – Packaging, machine learning, and integration technologies

Presentation no:

Title: Reliability, Solderability and Electrical Performance of High Density Ultra Thin Capacitors Based on Carbon Nanofibers  

Link: https://www.ectc.net/program/session36.cfm 

Session 45 – Heterogeneous integration, flex and emerging technologies

Presentation no:

Title: Flip Chip Interconnects Based on Carbon Nanofibers-Solder Composites

Link: https://www.ectc.net/program/session45.cfm

INTRODUCING CARBON CAPACITORS:

SEM picture of the CNF-MIM capacitor die

SEM picture shows side-view of the CNF-MIM die

”Capacitors so thin they fit everywhere”

Earlier this spring Smoltek presented: ”the thinnest capacitors in the world”. It's a prototype of our capacitor technology based on carbon nanofibers and how they are developed for further miniaturization of semiconductor components.

Carbon capacitor properties: High capacitance density | Low ESR | Low ESL | Extremely small form factor | So thin they fit (almost) everywhere.

Applications: Discrete component (embedded, landside, hybrid bonding) or fully integrated.

Related presentation, session 36: Reliability, Solderability and Electrical Performance of High Density Ultra Thin Capacitors Based on Carbon Nanofibers

©Smoltek-2021_CNF-MIM_die_Side-view_webb
©Smoltek-2021_CNF-MIM_capacitor_die_webb

Smoltek VP Product Management, Karl Lundahl on the next phase for CNF-MIM.

Smoltek explained in 30 seconds.

Learn more about carbon nanofibers

– properties, growth and applications

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Want to know more about Smoltek's capacitor technology?

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