---
title: "Is it time to Reinforce In-package Solder Joints Using CNF?"
canonical_url: "https://www.smoltek.com/is-it-time-to-reinforce-in-package-solder-joints-using-cnf/965/"
date: 2014-04-15
author: "Thomas Barregren"
featured_image: "https://www.smoltek.com/wp-content/uploads/2021/12/image-023-jpg.webp"
categories:
  - name: "Research"
    url: "https://www.smoltek.com/category/research.md"
---

# Is it time to Reinforce In-package Solder Joints Using CNF?

One-dimen­sion­al car­bon nanos­truc­tures have been known and fab­ri­cat­ed for more than a hun­dred years and were orig­i­nal­ly rWe describe a fast and cost-effec­tive process for the growth of car­bon nanofibers (CNFs) at a tem­per­a­ture com­pat­i­ble with cThe trend towards small­er inter­con­nects is start­ing to present assem­bly and reli­a­bil­i­ty chal­lenges. While desir­able by users, small­er diam­e­ter cop­per pil­lars present an even more sig­nif­i­cant chal­lenge to assem­blers and reli­a­bil­i­ty issues for end-users. How­ev­er, nanos­truc­tures in the form of car­bon nano-fibers (CNFs) embed­ded with sol­der or con­duc­tive epoxy pro­duce stronger com­po­nent inter­con­nec­tions that enable small­er diam­e­ter cop­per pil­lars. If desired, the rein­forced fiber bumps can be less than 10 μm in diam­e­ter and up to 20 μm high. Attach­ment of the fiber micro bumps uses con­ven­tion­al ther­mo­com­pres­sion bonding.

[Read more](https://issuu.com/mepcom/docs/meptec_report_spring_2014/20)