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Smoltek is featuerd in IEEE Spectrum

Smoltek sees chip packaging as the new frontier in nano electronics. Read more in our latest interview with IEEE Spectrum.

We are very happy to be featured in IEEE Spectrum. IEEE Spectrum is the flagship magazine and website of the IEEE, the world’s largest professional organization devoted to engineering and the applied sciences.

Read the interview here.

Watch our CEO Anders Johansson describe our technology in a video here.

#Article #IEEE

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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