Smoltek patent No. 70 now granted

Smoltek’s 70th pat­ent has been gran­ted in Taiwan and relates to the Assembly plat­form fam­ily, and this par­tic­u­lar applic­a­tion is in the field of inter­con­nects and het­ero­gen­eous integration.

Our Assembly plat­form pat­ent fam­ily is a path­way to tap into the ever-increas­ing demand for mini­atur­iz­a­tion of elec­tron­ic com­pon­ents and inter­con­nect them in the form of an assembly to min­im­ize foot­print at the pack­aging level.

“Through this pat­ent grant, we once again demon­strate our tech­nic­al and innov­at­ive abil­ity to take advant­age of the great poten­tial of our tech­no­logy plat­form,” says Karl Lundahl, VP Product man­age­ment & Indus­tri­al­iz­a­tion at Smoltek.

In the con­text of Assembly plat­form and inter­con­nects, the present applic­a­tions con­cepts take advant­age of the wet­tab­il­ity prop­er­ties of nano­struc­tures to form small sized com­pos­ite inter­con­nect bumps togeth­er with tra­di­tion­al solder/​metal mater­i­als. Such com­pos­ite inter­con­nects provide a means to improve the elec­tric­al reli­ab­il­ity of the solder/​metal bumps since car­bon nano­struc­tures are inher­ently cap­able of car­ry­ing high cur­rent at a much smal­ler footprint.

Smoltek’s pat­ent port­fo­lio now glob­ally com­prises 70 gran­ted pat­ents. Read more about our IP and patents.

Image: Karl Lundahl, VP Product Man­age­ment & Indus­tri­al­iz­a­tion at Smoltek