Search
  • Smoltek

Smoltek wins the Best Oral Paper Award at EDAPS 2019



Smoltek attended the international IEEE EDAPS conference for the first time come this last December. Besides presenting new and improved data for the CNF-MIM technology Vincent Desmaris also won the title ‘Best Oral Paper Award’.


The EDAPS symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials. Designers, engineers and researchers across the world come forth to share and discuss their work on all aspects of electrical signal integrity including modeling, design and simulation, fabrication, characterization and packaging.


At the conference, Vincent Desmaris, CTO of Smoltek, presented the Smoltek paper: “Ultra Thin Capacitors based on Carbon nanofibers with Ultra High Capacitance Density”, in which he said:

"We are taking the opportunity to present the latest achievements of our CNF-MIM technology, emphasizing our latest technological development. The CNF-MIM electrical data now feature an equivalent series resistance (ESR) of about 40 mΩ, which represents more than a twofold improvement compared to data released at SEMICON Taiwan 2019. This technological step also put us on a par with the other competing technologies when it comes to electrical data but at a fraction of their volume."


At the closing ceremony of the conference Vincent’s presentation was awarded ‘Best Oral Paper’-presentation. However, by then the Smoltek team had already left the conference for business meetings in Taiwan. In fact, it wasn’t until yesterday, when Vincent received an e-mail from the EDAPS 2019 secretariat informing him on the award, that we became aware of the achievement.


Still, late news can be good news.


___________________________________________________________________________


Image: Vincent Desmaris, CTO at Smoltek


#CNFMIM #advancedpackaging

#semiconductor

#VincentDesmaris

#IEEE

#EDAPS2019

320 views

Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

  • White Twitter Icon
  • White LinkedIn Icon
  • White Facebook Icon
  • White YouTube Icon

© 2005-2020 by Smoltek

Headquarters
Kaserntorget 7, S411 18 Gothenburg, Sweden

info@smoltek.com | +46 760 52 00 53

US location

470 Ramona Street, Palo Alto, CA 94301, USA

Newsletters

Get the latest news from Smoltek in your mailbox