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Vinnova project completed according to plan



The announced project within the framework of Vinnova's program "Smarter electronic systems” has been completed according to plan. Smoltek will now continue the work to achieve integration of CNF-MIM capacitors on 200 and 300 mm wafers.


”We are pleased to have participated in the project as we have gained useful experiences and also benefited greatly from the project”, says Ola Tiverman, President at Smoltek Semi. “Among other things, we have broadened our network of contacts within the existing customer base for CNF-MIM technology.”

The project has increased the possibilities for faster integration of CNF-MIM capacitors on 200 and 300 mm wafers through the developed contacts with both high-volume manufacturers of CVD systems and semiconductor foundries. Collaborations and interactions between Smoltek and a number of these parties are now continuing without the Vinnova framework.


Background to the project:

In November, Smoltek was granted financial support for feasibility studies by Vinnova within the framework of their program "Smarter electronic systems". The announcement launched the project "Towards the integration of carbon-based capacitors in industrial wafer production", which took place between November 2020 and March 2021. The goal was to create the necessary conditions for forming a consortium, which was the first part to then apply to the next step within Vinnova's "Smarter electronics system" program.


However, due to the short project time, combined with the current Covid-pandemic situation, and the fact that potential partners were not considered qualified as co-applicants to participate in a consortium according to the model for the next step in the "Smarter electronics systems" announcement, no new application has been made for the announcement that started in March this year.

Image: Ola Tiverman, President at Smoltek Semi


#CNFMIM #capacitors

#semiconductor

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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