---
title: "Published paper in Solid-State Electronics"
canonical_url: "https://www.smoltek.com/published-paper-in-solid-state-electronics/1301/"
date: 2017-11-03
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2021/12/f3d7c4_60d215162e8b42c68364114e305aec7cmv2-jpg.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "article"
    url: "https://www.smoltek.com/topic/article.md"
  - name: "capacitors"
    url: "https://www.smoltek.com/topic/capacitors.md"
---

# Published paper in Solid-State Electronics

The paper writ­ten by the Smoltek tech team describes extreme low pro­file 3D on-chip inte­grat­ed sol­id-state capac­i­tors based on VAC­N­Fs. The are­al capac­i­tance den­si­ty val­ue of 11–15 nF/​mm2 was achieved exploit­ing CMOS com­pat­i­ble micro­fab­ri­ca­tion process­es. Such extreme low pro­file with high val­ue capac­i­tance makes the tech­nol­o­gy a con­tender to be direct­ly inte­grat­ed on the active CMOS chip, or in mul­ti-chip pack­age and pas­sives on sil­i­con or glass inter­pos­er boost­ing 2.5D and 3D pack­ag­ing performances.

Read and down­load the paper [here](http://www.sciencedirect.com/science/article/pii/S0038110117307852).