Smoltek has yet another granted patent to add to its extensive IP portfolio. In November 2018 the Chinese patent office has issued the Letter of grant of the divisional patent application.
The granted patent covers different aspects of application of nanostructures in the field of interconnecting two adjacent layers which in this case may for example be two silicon chips (die) for electronic packaging purposes.
“We are witnessing the expansion of our patent portfolio towards different applications of our nanostructure technology. This particular patent is strengthening our position within the advanced packaging segment for integrated circuits with higher performance at a smaller footprint”, says Dr. M. Shafiq Kabir, Smoltek´s CIO.
Smoltek’s patent portfolio now globally comprises 51 granted patents. Read more about our IP and patents here.