Smoltek patent No. 52 now granted

April 10, 2019

 

 

Smoltek has yet another granted patent to add to our extensive IP portfolio. The Taiwanese patent office has issued the Letter of grant for another divisional patent regarding our Bumping technology family. 

 

The granted patent is an extension of our bumping family of patents and is covering application of nanostructures in the field of wafer level bumping and packaging. 

 

“Through this expansion of our patent portfolio footprint in Taiwan, we are strengthening our position within the advanced packaging technology segment, says Dr. M. Shafiq Kabir, Smoltek´s CIO.

 

Smoltek’s patent portfolio now globally comprises 52 granted patents. Read more about our IP and patents.

 

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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