Smoltek patent No. 54 now granted

October 11, 2019

 

Smoltek is awarded a new patent. This US patent is the first of a patent family in the direction of CNF-MIM capacitor applications on interposers. This brings our IP portfolio now to consists of 54 granted patents.

 

“This is the first granted patent from our second wave of patent filings that is protecting our CNF-MIM capacitor technology and various use cases for the same, primarily in the semiconductor and electronics spaces”, says Dr Shafiq Kabir, Founder and Chief Innovation Officer at Smoltek. 

 

Interposers are frequently used in today’s advanced packaging architectures for integrated circuits, for example commonly used for processors. The present patented concepts are built on the need to improve circuit performance by smarter integration of functional elements to the interposer. 

 

Our inventions facilitate such integration of extremely low-profile solid state energy storage devices such as CNF-MIM capacitors, closer to the connection points and power rails of the active chips. CNF-MIM offers industry’s smallest formfactor for integrated high-performance capacitors, this by providing very high capacitance per area at a fragment of height compared with today’s technologies. 

 

Dr Shafiq Kabir concludes: “This new patent grant has arrived in perfect time with respect to the industry’s need for new solutions for its advanced circuit architectures. It is rewarding to witness that that our R&D and IP protection schemes are well aligned and together provide new disruptive solutions to problems that traditional technologies cannot address.”

 

Smoltek’s patent portfolio now globally comprises 54 granted patents. Read more about our IP and patents.

 

Figure: example embodiment – expanded view of interposer assembly  

 

Top image: Smoltek Management team

 

 

 

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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