New Taiwanese Patent

January 10, 2017

 

We are happy to announce a new core patent in Taiwan. This is Smoltek´s third granted patent in Taiwan. 

 

“This is an important achievement that further strengthens our core patent portfolio. Taiwan represents an interesting market as the home of the leading semiconductor packaging industry.” says Anders Johansson, Smoltek´s CEO.

 

Smoltek’s patent portfolio now globally comprises 43 granted patents.

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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