Smoltek announce its 48th patent

July 11, 2017

 

The new Japanese patent covers an aspect of how nanostructures can be exploited to be used for joining two adjacent layers or substrates for interconnecting purposes.This includes carbon nanotubes, nanofibers, nanowires etc.

 

“We are very happy to see our IP footprint is constantly increasing in Japan for both core growth and application related patents portfolio based on nanostructures.” Says Dr. M. Shafiq Kabir, Smoltek´s CIO.

 

Smoltek’s patent portfolio now globally comprises 48 granted patents.

 

Read more about our patent portfolio here

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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