Smoltek in Chip Scale Review

August 1, 2017

 

The article Integrated solid-state capacitors based on carbon nanostructure written by the Smoltek tech team is published in the latest issue of Chip Scale Review.

 

Chip Scale Review is a global magazine covering device and wafer-level test, assembly, and packaging and covers high-density interconnection technologies including 3D packages, MEMS, and other wafer-fabricated devices. The magazine showcases the industry with exclusive editorial content that includes in-depth technical articles by industry technologists, market forecasts and updates from research institutions.

 

Read the latest issue of Chip Scale Review here.

 

Shortcut the Smoltek article here.

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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