Smoltek is featuerd in IEEE Spectrum

January 26, 2017

 

Smoltek sees chip packaging as the new frontier in nano electronics. Read more in our latest interview with IEEE Spectrum.

 

We are very happy to be featured in IEEE Spectrum. IEEE Spectrum is the flagship magazine and website of the IEEE, the world’s largest professional organization devoted to engineering and the applied sciences.

 

Read the interview here.

 

Watch our CEO Anders Johansson describe our technology in a video here.

Share on Facebook
Share on Twitter
Please reload

Recent Posts

Please reload

Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

  • White Twitter Icon
  • White LinkedIn Icon
  • White Facebook Icon
  • White YouTube Icon

© 2005-2019 by Smoltek

Headquarters
Kaserntorget 7, S411 18 Gothenburg, Sweden

info@smoltek.com | +46 760 52 00 53

US location

470 Ramona Street, Palo Alto, CA 94301, USA

Newsletters

Get the latest news from Smoltek in your mailbox