Component integration interconnects

The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.

SmolINCO™ is our technology concept based on carbon nanofibers to improve microbump interconnect performance in advanced semiconductor packaging. It consists of ultra-fine pitch interconnects that supports advanced component integration, providing higher performance at a significantly reduced footprint.


Benefits include 

  • CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.

  • The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.

  • CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.

  • Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.


White papers

Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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US location

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