The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.

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SmolINCO™ is our technology concept based on carbon nanofibers to improve microbump interconnect performance in advanced semiconductor packaging. It consists of ultra-fine pitch interconnects that supports advanced component integration, providing higher performance at a significantly reduced footprint.

 

Benefits include 

• CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.

• The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.

• CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.

• Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.

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