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SmolINCO™
Component integration interconnects
The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.
SmolINCO™ is our technology concept based on carbon nanofibers to improve microbump interconnect performance in advanced semiconductor packaging. It consists of ultra-fine pitch interconnects that supports advanced component integration, providing higher performance at a significantly reduced footprint.
Benefits include
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CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.
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The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.
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CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.
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Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.
Patents
PatentNo | Area |
---|---|
CN104600057B | China |
CN101313092B | China |
CN105575743A | China |
2 197 782 | Europe |
1 945 840 | Europe |
2 630 281 | Europe |
266 759 | India |
JP612 67 25 | Japan |
JP553 59 15 | Japan |
JP551 99 36 | Japan |
JP614 90 77 | Japan |
JP534 99 56 | Japan |
KR101 736 303 | South Korea |
KR101 386 268 | South Korea |
KR101 365 341 | South Korea |
I710082 | Taiwan |
I655695 | Taiwan |
I511208 | Taiwan |
US 8 253 253 | USA |
US 7 977 761 | USA |
US 8 415 787 | USA |
US 9 206 532 | USA |
US 10 840 203 | USA |
US 8 183 659 | USA |
US 8 815 332 | USA |
US 7 687 876 | USA |
US 7 777 291 | USA |