SmolINCO

Component integration interconnects

The SmolINCO™ concept improves the overall performance and reliability of existing Cu-based microbump technology and smoothens the scaling path down to ~5μm pitch, and beyond that solder free thermal compression bonding.

SmolINCO™ is our technology concept based on carbon nanofibers to improve microbump interconnect performance in advanced semiconductor packaging. It consists of ultra-fine pitch interconnects that supports advanced component integration, providing higher performance at a significantly reduced footprint.

 

Benefits include 

  • CNFs enhance today’s Cu-pillar interconnect technology by improving the reliability of the solder joint, particularly in the intermetallic alloy region at the interface between the two pillars.

  • The solder wetting properties of metal-coated CNF efficiently confine the solder to the volume of the CNF-based microbump by capillary effect, allowing for smaller bump sizes, finer pitches and improved production yield.

  • CNF-based microbumps improve the alignment between adjacent chips by its excellent solder wetting properties.

  • Nanoscale thermal conduction path significantly enhances heat dissipation from the packaged chips.

Patents

PatentNo
Area
CN104600057B
China
CN101313092B
China
CN105575743A
China
2 197 782
Europe
1 945 840
Europe
2 630 281
Europe
266 759
India
JP553 59 15
Japan
JP612 67 25
Japan
JP551 99 36
Japan
JP534 99 56
Japan
JP614 90 77
Japan
KR101 736 303
South Korea
KR101 386 268
South Korea
KR101 365 341
South Korea
I710082
Taiwan
I655695
Taiwan
I511208
Taiwan
US 8 253 253
USA
US 7 977 761
USA
US 9 206 532
USA
US 8 415 787
USA
US 10 840 203
USA
US 8 183 659
USA
US 8 815 332
USA
US 7 687 876
USA
US 7 777 291
USA

White papers