SmolINPO™ is our interposer concept based on super conductive nanostructures. It facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions.
SmolINPO™ is our interposer concept of miniaturized PCBs that fit into a capsule with integrated microcapacitors. All in all our circuit chassis consists of internal PCB made of silicon/glass, with integrated capacitors and space for memory and processor.
SmolINPO™ key features are based on conductive nanostructures. The interposer facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini- supercapacitors for multiple functions.
SmolINPO™ main benefits:
• Ultra-fine pitch integration
• Can carry capacitors, memory and processor
• Substrate of your choice
• CMOS compatible process
• Free up valuable space on the PCB
Production processes (Standard dry processes)
• CVD (Chemical Vapor Deposition)
• PECVD (Plasma Enhanced Chemical Vapor Deposition)
• ALD (Atomic Layer Deposition)
US 10 438 880