SmolINPO

Conductive interposers

SmolINPO™ is our interposer concept based on super conductive nanostructures. It facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini-supercapacitors for multiple functions.

SmolINPO™ is our interposer concept of miniaturized PCBs that fit into a capsule with integrated microcapacitors. All in all our circuit chassis consists of internal PCB made of silicon/glass, with integrated capacitors and space for memory and processor. 

SmolINPO™ key features are based on conductive nanostructures. The interposer facilitates ultra-fine pitch integration of multi-die SiP (System-in-Package) components as well as with integrated solid-state mini- supercapacitors for multiple functions. 

SmolINPO™ main benefits:

• Ultra-fine pitch integration
• Can carry capacitors, memory and processor • Substrate of your choice
• CMOS compatible process
• Free up valuable space on the PCB

 

Production processes (Standard dry processes)
• CVD (Chemical Vapor Deposition)
• PECVD (Plasma Enhanced Chemical Vapor Deposition)

• ALD (Atomic Layer Deposition)

Patents

White papers

Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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© 2005-2019 by Smoltek

Headquarters
Kaserntorget 7, S411 18 Gothenburg, Sweden

info@smoltek.com | +46 760 52 00 53

US location

470 Ramona Street, Palo Alto, CA 94301, USA

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