---
title: "Smoltek are in discussions about packaging requirements for CNF-MIM capacitors"
canonical_url: "https://www.smoltek.com/smoltek-are-in-discussions-about-packaging-requirements-for-cnf-mim-capacitors/8031/"
date: 2024-12-16
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2024/12/2024-12-tong-hsing-visit.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "advanced packaging"
    url: "https://www.smoltek.com/topic/advanced-packaging.md"
  - name: "capacitors"
    url: "https://www.smoltek.com/topic/capacitors.md"
  - name: "CMOS-standard"
    url: "https://www.smoltek.com/topic/cmos-standard.md"
  - name: "cnf-mim"
    url: "https://www.smoltek.com/topic/cnf-mim.md"
  - name: "nanotechnology"
    url: "https://www.smoltek.com/topic/nanotechnology.md"
  - name: "news"
    url: "https://www.smoltek.com/topic/news.md"
  - name: "semi news"
    url: "https://www.smoltek.com/topic/semi-news.md"
  - name: "Smoltek Semi"
    url: "https://www.smoltek.com/topic/smoltek-semi.md"
---

# Smoltek are in discussions about packaging requirements for CNF-MIM capacitors

> No semi­con­duc­tor com­po­nent is com­plete with­out prop­er pack­ag­ing, and our CNF-MIM capac­i­tors are no exception.
> 
> Dr. Farzan Gha­vani­ni, CTO at Smoltek.

Last week, Dr. Farzan Gha­vani­ni met with Heinz Ru, Pres­i­dent and CEO of Tong Hsing Elec­tron­ics, in Tai­wan to con­tin­ue their dis­cus­sions. The meet­ing focused on Smoltek’s CNF-MIM roadmap, includ­ing pack­ag­ing spec­i­fi­ca­tions for next gen­er­a­tions of CNF-MIM capac­i­tors. This is a con­tin­u­a­tion of the suc­cess­ful col­lab­o­ra­tion between the two com­pa­nies that start­ed ear­li­er this year, where they worked togeth­er on Smoltek’s Gen Zero capacitors.

**About Tong Hsing**  
Tong Hsing Elec­tron­ic indus­tries, based in Tai­wan, is a lead­ing glob­al provider in advanced micro­elec­tron­ic pack­ag­ing ser­vices. The com­pa­ny spe­cial­izes in ceram­ic sub­strates, hybrid micro­elec­tron­ics, and advanced pack­ag­ing solu­tions, sup­port­ing the devel­op­ment of cut­ting-edge tech­nolo­gies across mul­ti­ple industries.

* * *

*Peo­ple pic­tured in top pho­to: Farzan Gha­vani­ni and Tai­wan-based Chin Jung Kou from Smoltek togeth­er with Heinz Ru of Tong Hsing and colleagues.*