---
title: "Smoltek patent No. 57 now granted"
canonical_url: "https://www.smoltek.com/smoltek-patent-no-57-now-granted/1367/"
date: 2020-03-30
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2021/12/e4e89e_0f127e0126c24cb3985959d55ae67b93mv2-jpg.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "advanced packaging"
    url: "https://www.smoltek.com/topic/advanced-packaging.md"
  - name: "grantedpatent"
    url: "https://www.smoltek.com/topic/grantedpatent.md"
  - name: "ip"
    url: "https://www.smoltek.com/topic/ip.md"
  - name: "semiconductor"
    url: "https://www.smoltek.com/topic/semiconductor.md"
  - name: "shafiqkabir"
    url: "https://www.smoltek.com/topic/shafiqkabir.md"
---

# Smoltek patent No. 57 now granted

This is the sec­ond grant­ed patent in 2020 and as it is a Euro­pean (EPO) patent that will be val­i­dat­ed in rel­e­vant Euro­pean countries.

The actu­al inven­tion is a bond­ing film that uti­lizes con­duc­tive nanos­truc­tures, and there­by pro­vide prop­er­ties that enable fur­ther minia­tur­iza­tion of semi­con­duc­tor assemblies.

“The patent cov­ers essen­tial aspects of a bond­ing film com­pris­ing nanos­truc­tures that enables con­nec­tion between two adja­cent semi­con­duc­tor chips/​components for both mechan­i­cal and elec­tri­cal pur­pos­es. Such imple­men­ta­tion brings sub­stan­tial ben­e­fits in  advanced pack­ag­ing of semi­con­duc­tor com­po­nents, with poten­tial to replace todays thick and bulky bond­ing films,” says Shafiq Kabir, CIO at Smoltek.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 57 grant­ed patents. [Read more about our IP and patents.](https://www.smoltek.com/insights/patents/)

Image: Shafiq Kabir, CIO at Smoltek