---
title: "Smoltek patent No. 74 now granted"
canonical_url: "https://www.smoltek.com/smoltek-patent-no-74-now-granted/3677/"
date: 2022-06-13
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2022/06/fg-1200x675-1-jpg.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "grantedpatent"
    url: "https://www.smoltek.com/topic/grantedpatent.md"
  - name: "innovation"
    url: "https://www.smoltek.com/topic/innovation.md"
  - name: "ip"
    url: "https://www.smoltek.com/topic/ip.md"
  - name: "nanotechnology"
    url: "https://www.smoltek.com/topic/nanotechnology.md"
---

# Smoltek patent No. 74 now granted

Smoltek’s 74th patent has been grant­ed in the US and relates to the Assem­bly plat­form fam­i­ly, which is a path­way to tap into the ever-increas­ing demand for minia­tur­iza­tion of elec­tron­ic com­po­nents and inter­con­nect them in the form of an assem­bly to min­i­mize foot­print at the pack­ag­ing level.

> “Through this new patent grant we widen our glob­al IP-foot­print, and again show­case the great dis­rup­tive poten­tial of our tech­nol­o­gy platform.”,
> 
> says Farzan Gha­vani­ni, CTO at Smoltek.

In the con­text of our Assem­bly plat­form and inter­con­nects, the present appli­ca­tions con­cepts take advan­tage of the wet­ta­bil­i­ty prop­er­ties of nanos­truc­tures to form small sized com­pos­ite inter­con­nect bumps togeth­er with tra­di­tion­al solder/​metal mate­ri­als. Such com­pos­ite inter­con­nects pro­vide a means to improve the elec­tri­cal reli­a­bil­i­ty of the solder/​metal bumps since car­bon nanos­truc­tures are inher­ent­ly capa­ble of car­ry­ing high cur­rent at a much small­er footprint.

Smoltek’s patent port­fo­lio now glob­al­ly com­pris­es 74 grant­ed patents. [Read more about our IP and patents](https://www.smoltek.com/category/patents/).