---
title: "Smoltek presents new improved electrical data for CNF-MIM"
canonical_url: "https://www.smoltek.com/smoltek-presents-new-improved-electrical-data-for-cnf-mim/1357/"
date: 2019-12-17
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2021/12/e4e89e_d7c7c5948573429789a0e9f5fdedb139mv2_d_2000_1277_s_2-jpg.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "advanced packaging"
    url: "https://www.smoltek.com/topic/advanced-packaging.md"
  - name: "cnf-mim"
    url: "https://www.smoltek.com/topic/cnf-mim.md"
  - name: "componentsystems"
    url: "https://www.smoltek.com/topic/componentsystems.md"
  - name: "conference"
    url: "https://www.smoltek.com/topic/conference.md"
  - name: "edaps2019"
    url: "https://www.smoltek.com/topic/edaps2019.md"
  - name: "ieee"
    url: "https://www.smoltek.com/topic/ieee.md"
  - name: "semiconductor"
    url: "https://www.smoltek.com/topic/semiconductor.md"
  - name: "semiconductorindustry"
    url: "https://www.smoltek.com/topic/semiconductorindustry.md"
  - name: "vincentdesmaris"
    url: "https://www.smoltek.com/topic/vincentdesmaris.md"
---

# Smoltek presents new improved electrical data for CNF-MIM

Today Tues­day, Decem­ber 17, Smoltek has pre­sent­ed the lat­est advances of the CNF-MIM tech­nol­o­gy con­cept. Now we can show a sig­nif­i­cant improve­ment of the ESR para­me­ter since SEMICON Tai­wan in September.

“We are tak­ing the oppor­tu­ni­ty to present our CNF-MIM at EDAPS 2019, empha­siz­ing our lat­est tech­no­log­i­cal devel­op­ment. Our CNF-MIM now fea­tures an equiv­a­lent series resis­tance (ESR) of about 40 mΩ, which rep­re­sents more than a twofold improve­ment com­pared to data released at SEMICON Tai­wan 2019. This tech­no­log­i­cal step also put us on a par with the oth­er com­pet­ing tech­nolo­gies when it comes to elec­tri­cal data but at a frac­tion of their vol­ume.”, says Vin­cent Des­maris, CTO at Smoltek.

The offi­cial name of the con­fer­ence is “2019 IEEE Elec­tri­cal Design of Advanced Pack­ag­ing and Sys­tems Sym­po­sium ([EDAPS](https://edaps.org/))”. It is an annu­al flag­ship event in the Asia-Pacif­ic region and has con­sis­tent­ly served as a plat­form for dis­sem­mi­na­tion of lat­est research in the areas of elec­tri­cal design of chip, pack­age and system.

Image: Vin­cent Des­maris, CTO at Smoltek