---
title: "Smoltek Showcases Ultra-Thin Capacitor Technology for Next-Generation AI and High-Performance Computing"
canonical_url: "https://www.smoltek.com/smoltek-showcases-ultra-thin-capacitor-technology-for-next-generation-ai-and-high-performance-computing/11341/"
date: 2025-09-17
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2025/09/semicon-taiwan-2025-interview-02-1.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "atomic layer deposition"
    url: "https://www.smoltek.com/topic/atomic-layer-deposition.md"
  - name: "capacitors"
    url: "https://www.smoltek.com/topic/capacitors.md"
  - name: "cnf-mim"
    url: "https://www.smoltek.com/topic/cnf-mim.md"
  - name: "nanotechnology"
    url: "https://www.smoltek.com/topic/nanotechnology.md"
  - name: "news"
    url: "https://www.smoltek.com/topic/news.md"
  - name: "semi news"
    url: "https://www.smoltek.com/topic/semi-news.md"
  - name: "Smoltek Semi"
    url: "https://www.smoltek.com/topic/smoltek-semi.md"
---

# Smoltek Showcases Ultra-Thin Capacitor Technology for Next-Generation AI and High-Performance Computing

- Smoltek Semi, show­cased our ultra-thin capac­i­tor tech­nol­o­gy CNF-MIM (Car­bon Nanofiber Met­al-Insu­la­tor-Met­al) at Semi­con Tai­wan 2025 (Sep­tem­ber 10–12) in the ITRI booth.
- CNF-MIM tech­nol­o­gy is intend­ed for pow­er sup­ply in AI chips, high-per­for­mance com­put­ing (HPC) sys­tems and edge devices.
- CNF-MIM com­bines high capac­i­tance den­si­ty, low ESL and ESR and very thin form fac­tor – enabling advanced inte­gra­tion near/​under proces­sors. These prop­er­ties are cru­cial for the next gen­er­a­tion of chips.
- Unlike tra­di­tion­al deep trench capac­i­tors (DTC), Smoltek uses an addi­tive process where car­bon nanofibers grow direct­ly on the sub­strate. This allows struc­tures with high aspect ratios and large areas, and a dielec­tric that can be applied in an ALD step, which can reduce costs.

**Com­ments about Smoltek’s CNF-MIM Technology**

> **Dr. Arthur Lin (ITRI):** Empha­sizes that AI servers require high speed and low pow­er con­sump­tion, and that heat and ener­gy sav­ing are key. He believes that the CNF-MIM tech­nol­o­gy, with its high aspect ratio and large spe­cif­ic sur­face area, is a tech­ni­cal advantage.

> **Mag­nus Ander­s­son, CEO of Smoltek:** Sees the choice to present the tech­nol­o­gy at Semi­con Tai­wan as a val­i­da­tion of the com­pa­ny’s strat­e­gy. He also says that the mar­ket for AI, HPC and edge com­put­ing requires sta­ble, ener­gy-effi­cient and minia­tur­ized pow­er solutions.

* * *

Watch the inter­view with Dr. Arthur Lin of ITRI:

Read the offi­cial press release here: [Smoltek Show­cas­es Ultra-Thin Capac­i­tor Tech­nol­o­gy for Next-Gen­er­a­tion AI and High-Per­for­mance Com­put­ing at Semi­con Tai­wan](https://news.cision.com/smoltek-nanotech-holding-ab/r/smoltek-showcases-ultra-thin-capacitor-technology-for-next-generation-ai-and-high-performance-comput,c4235917).