---
title: "Smoltek signs evaluation license agreement with leading passive components manufacturer"
canonical_url: "https://www.smoltek.com/smoltek-signs-evaluation-license-agreement-with-leading-passive-components-manufacturer/1369/"
date: 2020-04-20
author: "Fredrik Liljeberg"
featured_image: "https://www.smoltek.com/wp-content/uploads/2021/12/e4e89e_2a66409171d7471d9f169e3915b44599mv2-jpg.webp"
categories:
  - name: "News"
    url: "https://www.smoltek.com/category/news.md"
tags:
  - name: "passivecomponents"
    url: "https://www.smoltek.com/topic/passivecomponents.md"
---

# Smoltek signs evaluation license agreement with leading passive components manufacturer

This is the sec­ond eval­u­a­tion license agree­ment that Smoltek has signed for its car­bon nanofiber-based capac­i­tor tech­nol­o­gy in 2020. The first agree­ment was signed in late March with one of the world’s largest man­u­fac­tur­ers of capacitors.

“In a short time, we have now signed two eval­u­a­tion license agree­ments for our car­bon nanofiber-based capac­i­tor tech­nol­o­gy with sig­nif­i­cant play­ers in the elec­tron­ics and semi­con­duc­tor indus­try. This shows that we have now reached a point where there is a firm com­mer­cial inter­est in this tech­nol­o­gy. Fur­ther­more, the fact that we sign this agree­ment under pre­vail­ing cir­cum­stances makes it clear that the elec­tron­ics indus­try is not paus­ing its for­ward-look­ing busi­ness due to the coro­n­avirus sit­u­a­tion,” says Smoltek’s CEO Anders Johansson.

“We have been work­ing with this cus­tomer for some time, and it is excit­ing that we now have been able to sign a for­mal eval­u­a­tion license agree­ment. This means that we can now inten­si­fy the col­lab­o­ra­tion with the aim of sup­port­ing them in the devel­op­ment of com­mer­cial prod­ucts based on Smoltek’s CNF-MIM tech­nol­o­gy,” says Smoltek’s COO Ola Tiverman.

Smoltek’s CNF-MIM tech­nol­o­gy enables the pro­duc­tion of high-per­for­mance capac­i­tors which can be made much thin­ner than with con­ven­tion­al tech­nol­o­gy, which is high­ly sought after for advanced 2.5D and 3D pack­ag­ing solu­tions for semi­con­duc­tor circuits.

Image: Smoltek R&D facilities