SmolTIM

Thermal interface materials

SmolTIM™ is Smoltek’s heat dissipation concept that facilitates higher performance and sustained lifetime for RF and Power Electronics components.

 

With higher component integration comes more power — and more heat – per area unit. Components running too hot provides reduced performance. Shorter lifetime is another result.

 

However, highly conductive nanostructure materials can efficiently transfer the heat to offload thermal stress. These materials can be processed in standard type tooling and be compatible with today’s production process and materials in use. 

SmolTIM™ benefits

The thermal films are based on carbon nanostructures that we can design/enigneer for use as thermal interface materials in order to cool off electronic units and devices as heat is one huge problem when it comes to miniaturization of microelectronics.

In our Smoltek Tiger assembly platform that will shrink the 2.5D/3D package by XX percent we incapsulate the interconnects, interposers, integrated capacitors by an thermal heat dissipation film.

 

That ultrathin film is the SmolTIM™.

Patents

PatentNo
Area
CN105441903B
China
CN101827782B
China
CN101313092B
China
CN103154340B
China
1 945 840
Europe
2 630 281
Europe
266 759
India
JP553 59 15
Japan
JP551 99 36
Japan
JP614 90 77
Japan
2 573 474
Russia
KR101 736 303
South Korea
KR101 487 346
South Korea
KR101 386 268
South Korea
KR101 365 341
South Korea
I655695
Taiwan
I564980
Taiwan
I511208
Taiwan
US 8 253 253
USA
US 7 977 761
USA
US 8 106 517
USA
US 8 253 253
USA
US 8 815 332
USA
US 7 777 291
USA
US 8 415 787
USA
US 9 206 532
USA

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