Smoltek has the intention to sign a global exclusive license and services agreement for discrete and embedded capacitors with YAGEO Group. This would grant YAGEO a global, exclusive right to manufacture and sell capacitor products based on Smoltek's patent protected technology platform for ultra-thin carbon nanofiber capacitors (CNF-MIM).
Advanced nano- and microelectronics are at the core of tomorrow’s hardware engineering. At Smoltek we are pioneering carbon nanotechnology that enables manufacturing of the next-generation solutions for the semiconductor industry. Currently the focus is on a new type of carbon nanofiber-based capacitor that fits in the extremely miniaturized packaging architectures being developed by chip manufacturers.
Smoltek Semi has developed a process for manufacturing of engineering samples in high volumes. This process will now be tested for production of CNF-MIM engineering samples in high volumes, as the first trial-run of capacitor prototypes (without the patent protected carbon nanofibers) was successful.
Philip Lessner, CTO at YAGEO Group says in an interview that he and Yageo sees a lot of potential in Smotek's disruptive CNF-MIM capacitor technology for making capacitors in extremely small form factors.
In mid-April, the management team of Smoltek Semi visited Taiwan for meetings and workshops with our collaboration partner YAGEO. Together, we also made a series of meetings with intended customers for Smotek's ultra-thin CNF-MIM capacitors.
Louise Duker, Chief Product Officer at Smoltek, talks about how Smoltek will take the company's technology concept from manufacturing in a laboratory environment to industrial production in a factory - and how the company's product range of ultra-thin capacitors will be developed.
Farzan Ghavanini, CTO and Head of R&D at Smoltek, explains the unique advantages of our disruptive carbon nanofiber capacitor technology. How we can make extremely small capacitors with high capacitance density, which is in high demand as the increasing power consumption of micro processors calls for ultrathin decoupling capacitors with Landside mounting.