Sign up for our newsletter!

Subscribe form (en)

No spam. Simply good reading. Get your free subscription to Smoltek Newsletter infrequently delivered straight to your inbox.

Your data will be handled in compliance with our privacy policy.

The enorm­ous poten­tial with­in the wide Smol­tek IP-plat­form is the base for our pur­suit in vari­ous tech­no­logy sec­tors. By eval­u­ate dif­fer­ent chal­lenges in each mar­ket we identi­fy new oppor­tun­it­ies for us to provide revo­lu­tion­iz­ing solu­tions for future applications.

Besides serving the semi­con­duct­or and hydro­gen indus­tries with new, dis­rupt­ive applic­a­tion tech­no­lo­gies we have already set up plans to scope new areas that can be bene­fi­cial of our tech­no­logy solu­tions, such as the energy stor­age sec­tor and the med-tech sec­tor. This, how­ever, are fields where we not yet have had enough time and recourses to fully explore.

Future solutions within energy storage

We con­tinu­ously eval­u­ate dif­fer­ent applic­a­tions in energy stor­age, and here bat­tery tech­no­logy is an inter­est­ing area where sur­face con­di­tions are cent­ral to per­form­ance, as today’s mater­i­als lim­it effi­ciency, ser­vice life and safety. As an example we can look at (Li-ion) sol­id-state bat­ter­ies which with our nan­o­tech­no­logy could offer high­er energy dens­ity, exten­ded char­ging capa­city, bet­ter tem­per­at­ure per­form­ance and reduced flam­mab­il­ity com­pared to today’s batteries.

Future solutions within semiconductors

We have pre­vi­ously developed a num­ber of tech­no­logy con­cepts for the semi­con­duct­or industry. These are at dif­fer­ent stages of devel­op­ment, but all of them have had to stand back due to our cur­rent devel­op­ment of ultra-thin capa­cit­ors. As the com­pany devel­ops, there is an oppor­tun­ity for us to resume some of them again.

SMOLTEK Tiger™ – smart assembly platform

Smol­tek Tiger is an assembly plat­form concept for advanced pack­aging and het­ero­gen­ous integ­ra­tion that con­sists of integ­rated capa­cit­ors, inter­con­nects and inter­posers that are incap­su­lated by a thermal heat dis­sip­a­tion film.

SmolINCO – component integration interconnects

The SmolINCO concept improves the over­all per­form­ance and reli­ab­il­ity of exist­ing Cu-based microbump tech­no­logy and smoothens the scal­ing path down to ~5μm pitch, and bey­ond that solder free thermal com­pres­sion bonding.

SmolINPO – Interposers concept

SmolINPO is our inter­poser concept based on super con­duct­ive nano­struc­tures. It facil­it­ates ultra-fine pitch integ­ra­tion of multi-die SiP (Sys­tem-in-Pack­age) com­pon­ents as well as with integ­rated sol­id-state mini-super­ca­pa­cit­ors for mul­tiple functions.

SmolTIM – Thermal enhancement materials

Smol­TIM is Smoltek’s heat dis­sip­a­tion concept that facil­it­ates high­er per­form­ance and sus­tained life­time for RF and Power Elec­tron­ics components.

SmolNIL – Nano imprint lithography

Smol­NIL is our nano­scale imprint tech­no­logy that enables us to fab­ric­ate high aspect ratio (>1:10) imprint mold/​mask with pre­defined shapes.

SmolCAP – Supercapacitors concept

Smol­CAP is an ultrath­in high per­form­ance super­ca­pa­cit­or concept based on our car­bon nan­ofiber technology.

Learn more

Want to know more about our dis­rupt­ive nan­o­tech­no­logy and how it can be imple­men­ted in dif­fer­ent industry sec­tors? Con­tact us!