Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions

While the den­si­ty of chip-to-chip and chip-to-pack­age com­po­nent inter­con­nec­tions increas­es and their size decreas­es the ease of man­u­fac­ture and the inter­con­nec­tion reli­a­bil­i­ty are being dan­ger­ous­ly reduced. This paper intro­duces the use of Car­bon Nanofibers (CNF) grown on chip as an embed­ded rein­forc­ing mate­r­i­al for nano-sol­der inter­con­nec­tions and as bond­ing mate­r­i­al (adhe­sive) for chip-to-pack­age solu­tions. Inter­con­nec­tions are real­ized by means of microbumps which can be less than 10 µm in diam­e­ter and up to 20 µm high. Such micro-bumps are shown to be sol­der­able using con­ven­tion­al ther­mal-com­pres­sion and micro-bumps. Using CNF embed­ded in poly­mer is shown to pro­vide a robust solu­tion for chip-to-pack­age interconnections.