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Carbon Nanofibers (CNF) for enhanced solder-based nano-scale integration and on-chip interconnect solutions

Research paper in the proceedings of 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 1071–1076.

While the dens­ity of chip-to-chip and chip-to-pack­age com­pon­ent inter­con­nec­tions increases and their size decreases the ease of man­u­fac­ture and the inter­con­nec­tion reli­ab­il­ity are being dan­ger­ously reduced. This paper intro­duces the use of Car­bon Nan­ofibers (CNF) grown on chip as an embed­ded rein­for­cing mater­i­al for nano-solder inter­con­nec­tions and as bond­ing mater­i­al (adhes­ive) for chip-to-pack­age solu­tions. Inter­con­nec­tions are real­ized by means of microbumps which can be less than 10 µm in dia­met­er and up to 20 µm high. Such micro-bumps are shown to be sol­der­able using con­ven­tion­al thermal-com­pres­sion and micro-bumps. Using CNF embed­ded in poly­mer is shown to provide a robust solu­tion for chip-to-pack­age interconnections.

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