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Research paper presented in the proceedings of the 53rd International Symposium on Microelectronics, IMAPS 2020, October 5-8, 2020.
M Bylund, R Andersson, A M Saleem, E Passalacqua, V Marknäs, V Desmaris, S Kabir, S Krause • November 26, 2020
We demonÂstrate the feaÂsiÂbilÂiÂty of impleÂmentÂing carÂbon nano fiber based metÂal-insuÂlaÂtor-metÂal (CNFMIM) capacÂiÂtors on difÂferÂent subÂstrates such as glass, aluÂmiÂna and silÂiÂcon for use as inteÂgratÂed or disÂcrete pasÂsive comÂpoÂnents on chips or interÂposers. The effects of biasÂing voltÂage and high operÂatÂing temÂperÂaÂtures on the perÂforÂmance of the devices are also invesÂtiÂgatÂed. CapacÂiÂtance denÂsiÂties of 300 nF/​mm2 are demonÂstratÂed on all subÂstrates at a device thickÂness of only 5 μm. The manÂuÂfacÂtured capacÂiÂtors feaÂture ESR valÂues at or below 100 mΩ, ESL below 15 pH and show litÂtle change in capacÂiÂtance denÂsiÂty when subÂjectÂed to biasÂing voltÂage below breakÂdown and temÂperÂaÂtures up to 150°C, makÂing them a promisÂing canÂdiÂdate for both inteÂgratÂed and disÂcrete miniaÂturÂized elecÂtronÂic comÂpoÂnents for future technology.
The paper was preÂsentÂed by VicÂtor Marknäs, Smoltek AB, GothenÂburg, SweÂden at the 53rd InterÂnaÂtionÂal SymÂpoÂsium on MicroÂelecÂtronÂics, IMAPS 2020, OctoÂber 5–8, 2020. Due to covid-19 this was a virÂtuÂal symÂpoÂsium. PreÂsentÂed by VicÂtor Marknäs, with honÂors. PreÂsenÂtaÂtion awardÂed the ‘Best of SesÂsion Paper’.
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