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Interconnects B

The Interconnects B family is covering how nanostructures can be used as interconnects and/or for dissipating heat from electronic devices.

S Kabir • August 28, 2006

The inven­tion: A way of man­u­fac­ture nanos­truc­tures grown on a con­duct­ing or insu­lat­ing sub­strate, and a method of mak­ing the same. The nanos­truc­tures grown accord­ing to the claimed method are suit­able for inter­con­nects and/​or as heat dis­si­pa­tors in elec­tron­ic devices. 

Down­load the patent grant­ed by USPTO.

Granted patents relating to the innovation

Patent OfficePatent
IndiaIN266759
USAUS7777291
USAUS8183659
USAUS8415787
For more infor­ma­tion about a par­tic­u­lar patent, click on its name to view it on Google Patents.

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