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Research paper published in the proceedings of 2021 IEEE 71st Electronic Components and Technology Conference (ECTC), 2021, pp. 1627-1632.
V Marknäs, R Andersson, M Bylund, Q Li, E Passalacqua, A M Saleem, V Desmaris • August 10, 2021
This paper invesÂtiÂgates the suitÂabilÂiÂty of the CarÂbon Nano-Fiber MetÂal-InsuÂlaÂtor-MetÂal (CNF-MIM) capacÂiÂtor for inteÂgraÂtion in future miniaÂturÂized elecÂtronÂics. The CNF-MIM has preÂviÂousÂly shown elecÂtriÂcal propÂerÂties suitÂable for use in a variÂety of appliÂcaÂtions such as digÂiÂtal elecÂtronÂics. The CNF-MIM capacÂiÂtors are subÂjectÂed to high ambiÂent temÂperÂaÂture and conÂstant voltÂage bias enviÂronÂments over long periÂods of time to assess their long-term duraÂbilÂiÂty. The devices are also subÂjectÂed to stanÂdard surÂface-mount solÂder reflow proÂceÂdure to invesÂtiÂgate the comÂpatÂiÂbilÂiÂty with indusÂtry-stanÂdard assemÂbly techÂniques. The capacÂiÂtors are charÂacÂterÂized in both DC and RF and are shown to be robust against degraÂdaÂtion in these sceÂnarÂios. FinalÂly, ultra-thin CNF-MIM capacÂiÂtors are manÂuÂfacÂtured, showÂing that the estabÂlished techÂnolÂoÂgy can be furÂther shrunk for furÂther miniaÂturÂizaÂtion and future applications.
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