Smoltek’s carbon based capacitors turns out to be right on target for the semiconductor industry

IMAPS Device Pack­ag­ing Con­fer­ence 2020 in Phoenix, Ari­zona gath­ered some of the very top semi­con­duc­tor com­pa­nies in the world for shar­ing the lat­est knowl­edge of the needs for future tech­nolo­gies. Like ‘How thin can we go?’.

Smoltek attend­ed the IMAPS 2020 Device Pack­ag­ing Con­fer­ence March, 2–5 2020, togeth­er with semi­con­duc­tor giants like Sam­sung, Qual­comm and ASE Group. And the main mes­sage of the con­fer­ence was that con­tin­u­ous col­lab­o­ra­tion is nec­es­sary for inno­va­tion as Rich Rice, ASE’s Senor VP of Busi­ness Devel­op­ment, empha­sized in his open­ing keynote.

Fol­low­ing up on the need for inno­va­tion, Chris­t­ian Hoff­mann, prin­ci­pal engi­neer at Qual­comm stat­ed in his keynote that: ”The sin­gle most impor­tant ques­tion for semi­con­duc­tor pack­ages for mobile phones is: How thin can we make it?”

”This res­onates quite well with Smolteks CNF-MIM tech­nol­o­gy as the thick­ness of the active capac­i­tor stack of the CNF-MIM tech­nol­o­gy is in the sin­gle dig­it microm­e­ter range. This ultra- low thick­ness of the active capac­i­tive ele­ment enables Smoltek’s licensees to man­u­fac­ture dis­crete capac­i­tors with an unprece­dent­ed low pro­file.”, Karl Lun­dahl VP Prod­uct Man­age­ments at Smoltek states.

Anders Johans­son, CEO of Smoltek, fills in: “This shows how our car­bon based capac­i­tor con­cept is right on tar­get for the semi­con­duc­tor indus­try, a new dis­rup­tive inno­va­tion that will sup­port con­tin­u­ous devel­op­ment of advanced pack­age architectures.”

Interactive sessions

On Wednes­day March 4, Vin­cent Des­maris, CTO of Smoltek, held an appre­ci­at­ed pre­sen­ta­tion in the pleas­ant Ari­zona after­noon spring. Hov­er­ing Vin­cent and the Smoltek poster were numer­ous curi­ous con­fer­ence atten­dants inquir­ing about the CNF-MIM tech­nol­o­gy and its advan­tages for the pack­ag­ing industry.

Besides the shar­ing the lat­est updates of our capac­i­tor inno­va­tion at the IMAPS Device Pack­ag­ing Con­fer­ence Smoltek also made sev­er­al new and sig­nif­i­cant con­nec­tions with new indus­try entities/​players that can be inter­est­ed for licensing/​development of the CNF-MIM-concept.

“IMAPS in Phoenix gath­ered the right com­pa­nies for one-on-one meet­ings as well as an envi­ron­ment for busi­ness intel­li­gence. And not at least great net­work­ing oppor­tu­ni­ties, all impor­tant for our future jour­ney”, Anders Johans­son, CEO of Smoltek, concluded.

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