Smoltek attended the IMAPS 2020 Device Packaging Conference March, 2–5 2020, together with semiconductor giants like Samsung, Qualcomm and ASE Group. And the main message of the conference was that continuous collaboration is necessary for innovation as Rich Rice, ASE’s Senor VP of Business Development, emphasized in his opening keynote.
Following up on the need for innovation, Christian Hoffmann, principal engineer at Qualcomm stated in his keynote that: ”The single most important question for semiconductor packages for mobile phones is: How thin can we make it?”
”This resonates quite well with Smolteks CNF-MIM technology as the thickness of the active capacitor stack of the CNF-MIM technology is in the single digit micrometer range. This ultra- low thickness of the active capacitive element enables Smoltek’s licensees to manufacture discrete capacitors with an unprecedented low profile.”, Karl Lundahl VP Product Managements at Smoltek states.
Anders Johansson, CEO of Smoltek, fills in: “This shows how our carbon based capacitor concept is right on target for the semiconductor industry, a new disruptive innovation that will support continuous development of advanced package architectures.”
On Wednesday March 4, Vincent Desmaris, CTO of Smoltek, held an appreciated presentation in the pleasant Arizona afternoon spring. Hovering Vincent and the Smoltek poster were numerous curious conference attendants inquiring about the CNF-MIM technology and its advantages for the packaging industry.
Besides the sharing the latest updates of our capacitor innovation at the IMAPS Device Packaging Conference Smoltek also made several new and significant connections with new industry entities/players that can be interested for licensing/development of the CNF-MIM-concept.
“IMAPS in Phoenix gathered the right companies for one-on-one meetings as well as an environment for business intelligence. And not at least great networking opportunities, all important for our future journey”, Anders Johansson, CEO of Smoltek, concluded.