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Vincent Desmaris At Impas Device Packaging 2020

Smoltek’s carbon based capacitors turns out to be right on target for the semiconductor industry

IMAPS Device Packaging Conference 2020 in Phoenix, Arizona gathered some of the very top semiconductor companies in the world for sharing the latest knowledge of the needs for future technologies. Like ‘How thin can we go?’.

March 6, 2020

Smol­tek atten­ded the IMAPS 2020 Device Pack­aging Con­fer­ence March, 2–5 2020, togeth­er with semi­con­duct­or giants like Sam­sung, Qual­comm and ASE Group. And the main mes­sage of the con­fer­ence was that con­tinu­ous col­lab­or­a­tion is neces­sary for innov­a­tion as Rich Rice, ASE’s Sen­or VP of Busi­ness Devel­op­ment, emphas­ized in his open­ing keynote.

Fol­low­ing up on the need for innov­a­tion, Chris­ti­an Hoff­mann, prin­cip­al engin­eer at Qual­comm stated in his key­note that: ”The single most import­ant ques­tion for semi­con­duct­or pack­ages for mobile phones is: How thin can we make it?”

”This res­on­ates quite well with Smol­teks CNF-MIM tech­no­logy as the thick­ness of the act­ive capa­cit­or stack of the CNF-MIM tech­no­logy is in the single digit micro­met­er range. This ultra- low thick­ness of the act­ive capa­cit­ive ele­ment enables Smoltek’s licensees to man­u­fac­ture dis­crete capa­cit­ors with an unpre­ced­en­ted low pro­file.”, Karl Lundahl VP Product Man­age­ments at Smol­tek states.

Anders Johans­son, CEO of Smol­tek, fills in: “This shows how our car­bon based capa­cit­or concept is right on tar­get for the semi­con­duct­or industry, a new dis­rupt­ive innov­a­tion that will sup­port con­tinu­ous devel­op­ment of advanced pack­age architectures.”

Interactive sessions

On Wed­nes­day March 4, Vin­cent Des­mar­is, CTO of Smol­tek, held an appre­ci­ated present­a­tion in the pleas­ant Ari­zona after­noon spring. Hov­er­ing Vin­cent and the Smol­tek poster were numer­ous curi­ous con­fer­ence attend­ants inquir­ing about the CNF-MIM tech­no­logy and its advant­ages for the pack­aging industry.

Besides the shar­ing the latest updates of our capa­cit­or innov­a­tion at the IMAPS Device Pack­aging Con­fer­ence Smol­tek also made sev­er­al new and sig­ni­fic­ant con­nec­tions with new industry entities/​players that can be inter­ested for licensing/​development of the CNF-MIM-concept.

“IMAPS in Phoenix gathered the right com­pan­ies for one-on-one meet­ings as well as an envir­on­ment for busi­ness intel­li­gence. And not at least great net­work­ing oppor­tun­it­ies, all import­ant for our future jour­ney”, Anders Johans­son, CEO of Smol­tek, concluded.

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