The enor­mous poten­tial with­in the wide Smoltek IP-plat­form is the base for our pur­suit in var­i­ous tech­nol­o­gy sec­tors. By eval­u­ate dif­fer­ent chal­lenges in each mar­ket we iden­ti­fy new oppor­tu­ni­ties for us to pro­vide rev­o­lu­tion­iz­ing solu­tions for future applications.

Besides serv­ing the semi­con­duc­tor and hydro­gen indus­tries with new, dis­rup­tive appli­ca­tion tech­nolo­gies we have already set up plans to scope new areas that can be ben­e­fi­cial of our tech­nol­o­gy solu­tions, such as the ener­gy stor­age sec­tor and the med-tech sec­tor. This, how­ev­er, are fields where we not yet have had enough time and recours­es to ful­ly explore.

Future solutions within energy storage

We con­tin­u­ous­ly eval­u­ate dif­fer­ent appli­ca­tions in ener­gy stor­age, and here bat­tery tech­nol­o­gy is an inter­est­ing area where sur­face con­di­tions are cen­tral to per­for­mance, as today’s mate­ri­als lim­it effi­cien­cy, ser­vice life and safe­ty. As an exam­ple we can look at (Li-ion) sol­id-state bat­ter­ies which with our nan­otech­nol­o­gy could offer high­er ener­gy den­si­ty, extend­ed charg­ing capac­i­ty, bet­ter tem­per­a­ture per­for­mance and reduced flam­ma­bil­i­ty com­pared to today’s batteries.

Future solutions within semiconductors

We have pre­vi­ous­ly devel­oped a num­ber of tech­nol­o­gy con­cepts for the semi­con­duc­tor indus­try. These are at dif­fer­ent stages of devel­op­ment, but all of them have had to stand back due to our cur­rent devel­op­ment of ultra-thin capac­i­tors. As the com­pa­ny devel­ops, there is an oppor­tu­ni­ty for us to resume some of them again.

SMOLTEK Tiger™ – smart assembly platform

Smoltek Tiger is an assem­bly plat­form con­cept for advanced pack­ag­ing and het­eroge­nous inte­gra­tion that con­sists of inte­grat­ed capac­i­tors, inter­con­nects and inter­posers that are incap­su­lat­ed by a ther­mal heat dis­si­pa­tion film.

SmolINCO – component integration interconnects

The SmolIN­CO con­cept improves the over­all per­for­mance and reli­a­bil­i­ty of exist­ing Cu-based microbump tech­nol­o­gy and smoothens the scal­ing path down to ~5μm pitch, and beyond that sol­der free ther­mal com­pres­sion bonding.

SmolINPO – Interposers concept

SmolIN­PO is our inter­pos­er con­cept based on super con­duc­tive nanos­truc­tures. It facil­i­tates ultra-fine pitch inte­gra­tion of mul­ti-die SiP (Sys­tem-in-Pack­age) com­po­nents as well as with inte­grat­ed sol­id-state mini-super­ca­pac­i­tors for mul­ti­ple functions.

SmolTIM – Thermal enhancement materials

SmolTIM is Smoltek’s heat dis­si­pa­tion con­cept that facil­i­tates high­er per­for­mance and sus­tained life­time for RF and Pow­er Elec­tron­ics components.

SmolNIL – Nano imprint lithography

Smol­NIL is our nanoscale imprint tech­nol­o­gy that enables us to fab­ri­cate high aspect ratio (>1:10) imprint mold/​mask with pre­de­fined shapes.

SmolCAP – Supercapacitors concept

Smol­CAP is an ultra­thin high per­for­mance super­ca­pac­i­tor con­cept based on our car­bon nanofiber technology.

Learn more

Want to know more about our dis­rup­tive nan­otech­nol­o­gy and how it can be imple­ment­ed in dif­fer­ent indus­try sec­tors? Con­tact us!