Community
Smoltek
2018
Solid State Technology, July 13 – Scaling: Getting to 3nm
Ny Teknik, March 20 – Odlade fibrer ger snabbare datorer
Göteborgs-Posten, January 9 – Han tar göteborgsk nanoteknik till börsen
Dagens Industri, January 3 – Så vill nanoforskarna rädda Moores lag
2017
Chip Scale Review, July 31 – Integrated Solid-State Capacitors Based On Carbon Nanostructures
Evaluation Engineering, March 20 – Shrinking packages if not transistors
All About Circuits, February 3 – New CVD Technology Allows Smaller Chip Packaging for SoCs and SiPs
IEEE Spectrum, January 26 – Nanomaterials Enable Smaller Chip Packaging
2016
Nanotech Mag, December 7 – Beyond Moore Smoltek are using carbon nanostructures as the assembly platform in semiconductor advanced packaging
Elektroniktidningen, December 2 – Bygger kondensatorer av fibrer
Electronics 360, October 18 – Swedish Nanotechnology Start-up Company to Discuss Carbon Nanostructures at SEMICON Europa
Nanotech Mag, October 17 – Game changing nanomaterial semiconductor technology from Swedish company
3D In Cites, June 17 – Supplier updates from ECTC 2016
3D In Cites, June 16 – Advancements in Carbon Nanostructures for Advanced Packaging Applications
EE Times Asia, June 8 – Carbon Nanofibres key to shrinking IC packaging
EE Times Europe, June 7 – Swedish startup to shrink IC packaging with carbon nanofibers
EE Times, May 25 – Ultra-Dense 3-D Packaging for IoT, Smoltek Beats Moore´s Law
Dagens Industri, April 17 – Nanoteknink gör framsteg
>p>Nanotech Mag, April 11 – Swedish nanoelectronics company Smoltek chosen for award
Semiconductor Industry
2017
Semiconductor Engineering, July 10 – Advanced Packaging Picks Up Steam
Phys.org, July 5 – Three-dimensional chip combines computing and data storage
Semiconductor Engineering, April 10 – 2.5D, FO-WLP Issues Come Into Focus
3DInCites, March 21 – Highlights of the 23rd TSMC Symposium
Quartz, March 8 – Moore’s Law can’t last forever—but two small changes might mean your phone battery will
Imec, February 8 – Imec, Holst Centre and ROHM Present Breakthrough Solution for Ultra Low Power Internet of Things radios
BCC Research, January 9 – Is NRAM Creating Market Volatility?
IEEE Spectrum, January 6 – Graphene- Girded Interconnects could enable next gen chips
2016
The Next Platform, November 28 – Nvidia CEO´s “Hyper-Moore´s law” vision for future supercomputers
i-Micronews, November 10 – Advanced Packaging: the rising wave of the semiconductor industry
EE Times, November 2 – Anticipating a More Virtual Moore´s Law
Research Institutes
Chalmers University of Technology, MC2 – http://www.chalmers.se/en/departments/mc2/Pages/default.aspx
IMEC – https://www.imec-int.com/en/home
Leti – http://www-leti.cea.fr/en
Georgia Tech, IEN – http://www.ien.gatech.edu/
Franhofer – http://www.izm.fraunhofer.de/en.html
Scientific Journals
MEPTEC (MicroElectronics Packaging and Test Engineering Council) is a trade association of semiconductor suppliers, manufacturers, and vendors concerned exclusively with packaging, assembly, and test. http://www.meptec.org
Chip Scale Review is the leading global magazine going into its 18th year covering device and wafer-level test, assembly, and packaging. http://www.chipscalereview.com