“This is a break­through in our CNF-MIM per­for­mance. The com­bi­na­tion of CNF elec­trodes with a ZrO₂/​Al₂O₃ stack, not only lever­ages the proven reli­a­bil­i­ty of DRAM-grade dielectrics but also deliv­ers excep­tion­al TCC and VCC char­ac­ter­is­tics that out­per­forms what’s cur­rent­ly offered by the ultra-thin MLCCs being used as land­side decou­pling capac­i­tors in high-end processors”.

Farzan Gha­vani­ni, CTO of Smoltek

Key Per­for­mance Highlights:

• Ther­mal Sta­bil­i­ty (TCC): The test­ed capac­i­tors main­tained robust per­for­mance up to 125°C, exhibit­ing only ~2.5% change in capac­i­tance from room tem­per­a­ture (22°C). No signs of degra­da­tion were observed, under­scor­ing the dura­bil­i­ty and reli­a­bil­i­ty of the dielec­tric stack under extend­ed ther­mal stress.
• Volt­age Sta­bil­i­ty (VCC): When test­ed across a bipo­lar volt­age range of ±4V, the devices only showed as lit­tle as ~3% change in capac­i­tance, fur­ther val­i­dat­ing the dielec­tric integri­ty. At a 2V oper­at­ing range — the tar­get rat­ing volt­age rep­re­sent­ing the land­side appli­ca­tion — the capac­i­tance shift was con­tained with­in ~1%, high­light­ing the suit­abil­i­ty of these devices for high-per­for­mance systems.

A Leap For­ward in Smoltek’s CNF-MIM Tech­nol­o­gy
The advanced dielec­tric stack, com­posed of zir­co­ni­um oxide (ZrO₂) and alu­minum oxide (Al₂O₃), that Smotek Semi are using in the pro­to­types is the same stack used in the charge stor­age capac­i­tor of most advanced DRAM technologies.

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Read the offi­cial press release here: Smoltek Smoltek Achieves Indus­tri­al Stan­dard in Ther­mal and Volt­age Sta­bil­i­ty in CNF-MIM Capac­i­tor Tech­nol­o­gy.