Assembly platform

The inven­tion: An assembly plat­form for arrange­ment as an inter­poser device between an integ­rated cir­cuit and a sub­strate to inter­con­nect the integ­rated cir­cuit and the sub­strate through the assembly plat­form, the assembly plat­form com­pris­ing: an assembly sub­strate; a plur­al­ity of con­duct­ing vias extend­ing through the assembly sub­strate; at least one nano­struc­ture con­nec­tion bump on a first side of the assembly sub­strate, the nano­struc­ture con­nec­tion bump being con­duct­ively con­nec­ted to the vias and defin­ing con­nec­tion loc­a­tions for con­nec­tion with at least one of the integ­rated cir­cuit and the sub­strate, wherein each of the nano­struc­ture con­nec­tion bumps com­prises: a plur­al­ity of elong­ated con­duct­ive nano­struc­tures ver­tic­ally grown on the first side of the assembly sub­strate, wherein the plur­al­ity of elong­ated nano­struc­tures are embed­ded in a met­al for the con­nec­tion with at least one of the integ­rated cir­cuit and the sub­strate, at least one con­nec­tion bump on a second side of the assembly sub­strate, the second side being oppos­ite to the first side, the con­nec­tion bump being con­duct­ively con­nec­ted to the vias and defin­ing con­nec­tion loc­a­tions for con­nec­tion with at least one of the integ­rated cir­cuit and the substrate.

Granted patents relating to the innovation