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The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.
J Berg, V Desmaris, S Kabir, A Brud • September 10, 2008
The invenÂtion: An appaÂraÂtus comÂprisÂing two conÂducÂtive surÂfaces or layÂers and a nanosÂtrucÂture assemÂbly bondÂed to the two conÂducÂtive surÂfaces or layÂers to creÂate elecÂtriÂcal or therÂmal conÂnecÂtions between the two conÂducÂtive surÂfaces or layÂers, and a method of makÂing same.
Patent Office | Patent |
---|---|
ChiÂna | CN101827782 |
ChiÂna | CN104600057 |
Europe | EP2197782 |
Japan | JP5535915 |
Japan | JP6149077 |
South Korea | KR101487346 |
TaiÂwan | TWI511208 |
TaiÂwan | TWI564980 |
TaiÂwan | TWI655695 |
USA | US8106517 |
USA | US8253253 |
USA | US8815332 |
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