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Ep2197782b1.pdf

Bumping

The Bumping family is an apparatus connecting and bonding adjacent layers with nanostructures.

J Berg, V Desmaris, S Kabir, A Brud • September 10, 2008

The inven­tion: An appa­ra­tus com­pris­ing two con­duc­tive sur­faces or lay­ers and a nanos­truc­ture assem­bly bond­ed to the two con­duc­tive sur­faces or lay­ers to cre­ate elec­tri­cal or ther­mal con­nec­tions between the two con­duc­tive sur­faces or lay­ers, and a method of mak­ing same.

Down­load the patent grant­ed by EPO.

Granted patents relating to the innovation

Patent OfficePatent
Chi­naCN101827782
Chi­naCN104600057
EuropeEP2197782
JapanJP5535915
JapanJP6149077
South KoreaKR101487346
Tai­wanTWI511208
Tai­wanTWI564980
Tai­wanTWI655695
USAUS8106517
USAUS8253253
USAUS8815332
For more infor­ma­tion about a par­tic­u­lar patent, click on its name to view it on Google Patents.

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