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Ep2250661b1.pdf

Helplayer

The Helplayer family is covering a method to protect the underlaying substrate or materials from being damaged during the nanostructure growth process.

The invention: A method for making one or more nanostructures is disclosed, the method comprising: depositing a conducting layer on an upper surface of a substrate; depositing a patterned layer of catalyst on the conducting layer; growing the one or more nanostructures on the layer of catalyst; and selectively removing the conducting layer between and around the one or more nanostructures. A device is also disclosed, comprising a substrate, wherein the substrate comprises one or more exposed metal islands separated by one or more insulating areas; a conducting helplayer disposed on the substrate covering at least some of the one or more exposed metal islands or insulating areas; a catalyst layer disposed on the conducting helplayer; and one or more nanostructures disposed on the catalyst layer.

Granted patents relating to the innovation

Patent OfficePatent
ChinaCN102007571
ChinaCN105441903
EuropeEP2250661
IndiaIN327303
JapanJP5474835
JapanJP5943947
JapanJP6126725
South KoreaKR101638463
TaiwanTWI465389
USAUS8508049
USAUS8866307
USAUS9114993
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