In Sep­tem­ber, Smoltek Semi attend­ed IEEE ESTC 2026 in Helsin­ki to fol­low devel­op­ments in advanced pack­ag­ing, wafer-lev­el pro­cess­ing, reli­a­bil­i­ty and pow­er elec­tron­ics to iden­ti­fy appli­ca­tion areas where CNF-MIM can address spe­cif­ic indus­try needs.

“The con­fer­ence pro­vid­ed an oppor­tu­ni­ty to meet rel­e­vant Euro­pean sup­pli­ers and poten­tial part­ners, par­tic­u­lar­ly for BEOL process­es, bump­ing, balling and pack­ag­ing. And we held dis­cus­sions with poten­tial cus­tomers and end-user sys­tem integrators.”

Shuangxi Sun, Project Man­ag­er at Smoltek Semi

For Smoltek, the oppor­tu­ni­ty is there­fore not sim­ply to devel­op a bet­ter capac­i­tor, but poten­tial­ly an inte­grat­ed pow­er-deliv­ery com­po­nent posi­tioned close to the chip. This could be rel­e­vant in appli­ca­tions such as AI com­put­ing, pho­ton­ics and oth­er advanced semi­con­duc­tor systems.

“A key take­away was that advanced pack­ag­ing is evolv­ing beyond sim­ply con­nect­ing a chip to a pack­age. Increas­ing­ly, chips, capac­i­tors, sub­strates, inter­con­nects and ther­mal man­age­ment are being designed as an inte­grat­ed sys­tem. This cre­ates oppor­tu­ni­ties for new mate­ri­als and inte­gra­tion con­cepts that can improve per­for­mance while sav­ing space – an envi­ron­ment that is rel­e­vant to Smoltek’s CNF-MIM technology.”

Shuangxi Sun

The next step is to trans­late these tech­nol­o­gy devel­op­ments and mar­ket needs into qual­i­fied, man­u­fac­turable prod­ucts and to build the sup­pli­er ecosys­tem required to sup­port cus­tomer eval­u­a­tion and future com­mer­cial production.

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Read more about our ultra-thin CNF-MIM capac­i­tors.