The offi­cial name of the con­fer­ence is “2019 IEEE Elec­tri­cal Design of Advanced Pack­ag­ing and Sys­tems Sym­po­sium (EDAPS)”. It is an annu­al flag­ship event in the Asia-Pacif­ic region and has con­sis­tent­ly served as a plat­form for dis­sem­mi­na­tion of lat­est research in the areas of elec­tri­cal design of chip, pack­age and system.

This sym­po­sium con­sists of tech­ni­cal paper pre­sen­ta­tion, poster ses­sions, indus­try exhibits, work­shops and tuto­ri­als. Design­ers, engi­neers and researchers across the world come forth to share and dis­cuss their work on all aspects of elec­tri­cal pack­ag­ing includ­ing mod­el­ing, design and sim­u­la­tion, fab­ri­ca­tion and characterization.

“This will be a great net­work­ing oppor­tu­ni­ty as well as a great venue for pre­sent­ing our lat­est achieve­ments of the CNF-MIM capac­i­tors tech­nol­o­gy”, says Ola Tiver­man, Chief Oper­a­tion Offi­cer at Smoltek.

On Tues­day, Decem­ber 17, Smoltek will present the lat­est advances of the CNF-MIM tech­nol­o­gy con­cept. The name of the is “Ultra-Thin Capac­i­tors based on Car­bon nanofibers with Ultra-High Capac­i­tance Den­si­ty” and will be held by prof. Vin­cent Des­maris in ses­sion 2 of the conference.

Image: Vin­cent Des­maris, CTO at Smoltek