This is the second granted patent in 2020 and as it is a European (EPO) patent that will be validated in relevant European countries.
The actual invention is a bonding film that utilizes conductive nanostructures, and thereby provide properties that enable further miniaturization of semiconductor assemblies.
“The patent covers essential aspects of a bonding film comprising nanostructures that enables connection between two adjacent semiconductor chips/components for both mechanical and electrical purposes. Such implementation brings substantial benefits in advanced packaging of semiconductor components, with potential to replace todays thick and bulky bonding films,” says Shafiq Kabir, CIO at Smoltek.
Smoltek’s patent portfolio now globally comprises 57 granted patents. Read more about our IP and patents.
Image: Shafiq Kabir, CIO at Smoltek