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Smoltek is attending EDAPS 2019 in Taiwan

Updated: Jan 28, 2020

The EDAPS conference in Kaohsiung Taiwan, December 16-19 will be an excellent forum to highlight the latest advances for our CNF-MIM capacitor technology concept.

The official name of the conference is “2019 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS)”. It is an annual flagship event in the Asia-Pacific region and has consistently served as a platform for dissemmination of latest research in the areas of electrical design of chip, package and system.

This symposium consists of technical paper presentation, poster sessions, industry exhibits, workshops and tutorials. Designers, engineers and researchers across the world come forth to share and discuss their work on all aspects of electrical packaging including modeling, design and simulation, fabrication and characterization.

“This will be a great networking opportunity as well as a great venue for presenting our latest achievements of the CNF-MIM capacitors technology”, says Ola Tiverman, Chief Operation Officer at Smoltek.

On Tuesday, December 17, Smoltek will present the latest advances of the CNF-MIM technology concept. The name of the is “Ultra-Thin Capacitors based on Carbon nanofibers with Ultra-High Capacitance Density” and will be held by prof. Vincent Desmaris in session 2 of the conference.

Image: Vincent Desmaris, CTO at Smoltek

#CNFMIM #advancedpackaging #semiconductor #componentsystems #semiconductorindustry #VincentDesmaris #conference #IEEE #EDAPS2019

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Smoltek provides groundbreaking technology for the new wave of heterogeneous integration and advanced semiconductor packaging. 

By pioneering carbon nanotechnology we keep scaling advanced semiconductor packaging technologies on a system level.

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