Sign up for our newsletter!
Your data will be handled in compliance with our privacy policy.
Published paper in Solid-State Electronics
We are happy to announce that our paper "Integrated on-chip solid state capacitor based on vertically aligned carbon nanofibers, grown using a CMOS temperature compatible process" is published in the academic journal Solid-State Electronics.
November 3, 2017
The paper written by the Smoltek tech team describes extreme low profile 3D on-chip integrated solid-state capacitors based on VACNFs. The areal capacitance density value of 11–15 nF/mm2 was achieved exploiting CMOS compatible microfabrication processes. Such extreme low profile with high value capacitance makes the technology a contender to be directly integrated on the active CMOS chip, or in multi-chip package and passives on silicon or glass interposer boosting 2.5D and 3D packaging performances.
Read and download the paper here.
Sign up for our newsletter!
Your data will be handled in compliance with our privacy policy.
Related news and insights
IR Blog Posts
September 5, 2024
Why Smoltek doubles down on qualified research
Smoltek’s focus on qualified research places it firmly in the Explorer quadrant of the R&D Evaluation Matrix, a model for assessing a company’s research and development strategy. Discover why this matters to investors and how Smoltek translates groundbreaking research into valuable business opportunities.
IR Blog Posts
February 27, 2025
Capacitors’ capacity for minimizing CO₂ footprint – a small story
In an age where environmental sustainability is of utter importance, it is crucial to find innovative solutions to reduce energy consumption and minimize our carbon footprint. One such solution is found in capacitors. These unassuming electronic components not only play an important role in various systems, but also offer significant environmental benefits. Albeit very small – if counted one by one.
News
August 12, 2024
Smoltek is seeking strong partners for industrialization of CNF-MIM capacitors
Smoltek's CNF-MIM technology offers a competitive alternative to silicon capacitors for ultra-thin high-performance capacitors used in processors for mobile phones and computers. The next-generation capacitors, Gen-One, is planned to be completed by the end of 2024, matching competitors in performance with an exceptionally thin form factor. The strategic objective is to pair up with a financially strong partner for the industrialization and commercialization of the capacitors.
IR Blog Posts
January 9, 2025
Deep Trench Capacitors (DTC) is a dead end – CNF-MIM is the way forward
Modern electronics demand increasingly compact and powerful capacitors, and the race for miniaturization has reached a critical juncture. While both Deep Trench Capacitors (DTC) and Carbon Nanofiber Metal-Insulator-Metal (CNF-MIM) capacitors are being developed for advanced applications requiring smaller size and higher capacitance density than conventional surface-mounted capacitors, DTC pushes the boundaries of what’s achievable with subtractive manufacturing, but is hitting fundamental physical limits. In contrast, Smoltek’s innovative CNF-MIM technology offers a revolutionary path forward, unrestricted by these constraints.
IR Blog Posts
October 1, 2024
Why increased capacitance density matter
Smoltek Semi has developed a new material for use in CNF-MIM capacitors. The new material increases capacitance by more than three times and reduces leakage current by 50 percent. In this article, we examine what this means and why it is good for shareholders and investors.
IR Blog Posts
October 11, 2024
New method accelerates CNF-MIM development
Our innovative “zapping” method drastically reduces development time and costs, enabling us to advance CNF-MIM technology faster and making Smoltek Semi’s technology even more attractive to potential buyers. Read on to see how this new process strengthens our position and shortens our path to market.